FL30P01,P-Channel 30V-WLCSP Power MOSFET

FEATURES
? Power MOSFET Technology
? Ultra Low Qg and Qgd
? High Speed
? Small Footprint 0.677mm × 0.743mm
? Low Profile 0.25mm Height
? Pb Free / RoHS Compliant
? WLCSP Package

APPLICATIONS
? Power Management
? Load Switch
? Battery Protection
? DC/DC Converter
? DSC
? LCD Display
? Load Switch

DESCRIPTION
True wafer level chip-scale packaging is available . The WLCSP package is one-fifty-eight h the footprint of a comparable SOP-8 package and has a profile of less
than 0.42mm. The device has been designed to deliver the lowest on resistance and gate charge in the smallest outline possible with excellent thermal characteristics in an ultra-low profile.